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硅脂蒙冤?Core i7-3770K开盖前后温度对比

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Old 28-04-2012, 09:22 PM
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Default 硅脂蒙冤?Core i7-3770K开盖前后温度对比

最近有关Ivy Bridge满载温度过高的原因问题引发了不少争议。国外网站OverClockers.com勇敢地拆掉了处理器的散热顶盖(IHS),发现位于内核(die)和顶盖之间的并非之前所用的软钎焊工艺低熔点金属材料(锡等),而是非常普通的硅脂。Intel以往只在低端CPU的内部使用硅脂,这次竟然连最高端的Core i7-3770K也不例外,成本节约得有些过份了,再加上金属的导热能力是硅脂的十几倍,很容易让人以为高温的罪魁祸首就是这层硅脂。但是真的如此么?PCEVA论坛的管理员royalk同学本着我不下地狱谁下地狱的精神,冒险对一颗Core i7-3770K进行了开盖,并实际测试了前后的运行温度,结果颇为意外。特别提醒:CPU的开盖行为非常危险,不但会失去保修,稍不注意还很容损伤核心,彻底报废,完全没有回转的机会,所以欢迎大家围观,但绝对不要效仿!刊载本文仅出于信息传播和
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